4通道PLC型CWDM/LAN-WDM芯片

产品中心

AWG耦合组件

产品介绍：
基于PLC技术AWG型DEMUX和MUX芯片将不同波长的光信号合并进入一个信道内，或者将一个信道内不同波长的光分离进入不同信道，可以提高数据传输的容量。根据不同波长间隔，可以分别使用于CWDM或LAN-WDM传输系统中。AWG具有尺寸紧凑，插入损耗小，波长可选择，可靠性的特点。

产品特点：

低插入损耗
高隔离度
尺寸紧凑
低成本
高可靠性

产品运用：

数据中心
光通讯网络
100G/400G 高速模块

AWG CWDM-4 Specifications:

Item	Condition/Measure Method	Unit	Type
Item	Condition/Measure Method	Unit	Mux	Demux
Channel			4
Spacing		nm	20
CWL	25℃@3dB Center	nm	CH1：1271
			CH2：1291
			CH3：1311
			CH4：1331
CWL Accuracy	25℃@3dB Center	nm	±1
1dB Bandwidth		nm	≥10	≥12
3dB Bandwidth		nm	≥14	≥15
Uniformity	All chip ILmax-ILmin	dB	≤1.5	≤1.0
Insertion Loss	@Passband±5nm；Including PDL and fiber coupling	dB	4.5	≤2.5
Polarization Dependent Loss	Passband±1nm	dB	≤0.5
Ripple	Passband±5nm	dB	≤1.0
Return Loss		dB	≥40
Isolation（Adjacent）	Passband±6.5nm	dB	/	≥20
Isolation（Non-Adjacent）	Passband±6.5nm	dB	/	≥30
Polarization Mode Dispersion		PS	≤0.15	≤0.15
Temperature Dependent Loss	-50~+85℃	dB	≤0.5	≤0.5
Wavelength thermal stability		Nm/℃	≤0.012	/
Channel Pitch		um	500	250
Input/Output Side			Identical Side	Opposite Side
Chip Size	Max Size	mm	≤7.6´4.0	≤10.0´1.6
Chip Height		mm	≤1.3	≤1.0
Polishing angle		°	NA	41
Operating Temperature		℃	-5~+80
Storage Temperature		℃	-40~+85

AWG LAN WDM4 Specifications:

Item	Condition/Measure Method	Unit	Type
Item	Condition/Measure Method	Unit	Mux	Demux
Channel			4
Spacing		GHz	800
CWL	25℃@3dB Center	nm	CH1：1295.56nm(231.4THz)
			CH2：1300.05nm(230.6THz)
			CH3：1304.58nm(229.8THz)
			CH4：1309.14nm(229.0THz)
CWL Accuracy	25℃@3dB Center	nm	±0.3
1dB Bandwidth		nm	≥2.2	≥2.8
Unifomity	All chip ILmax-ILmin	dB	≤1.5	≤1.0
Insertion Loss	@Passband±5nm；Including PDL and fiber coupling	dB	4.5	≤2.5
Polarization Dependent Loss	Passband±1nm	dB	≤0.5
Ripple	Passband±5nm	dB	≤1.25
Return Loss		dB	≥40
Isolation（Adjacent）	Passband±6.5nm	dB	/	≥20
Isolation（Non-Adjacent）	Passband±6.5nm	dB	/	≥30
Polarization Mode Dispersion		PS	≤0.2	≤0.2
Temperature Dependent Loss	-50~+85℃	dB	≤0.5	≤0.5
Wavelength thermal stability		Nm/℃	≤0.012	/
Channel Pitch		um	250	250
Chip Size	Max Size	mm	7.6×2.6	9.80×2.6
Chip Height		mm	≤1.3	≤1.0
Polishing angle		°	NA	41
Operating Temperature		℃	-5~+80
Storage Temperature		℃	-40~+85